Surface modification layer for conductive feature formation
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJian-Jou Lian, Kuo-Bin Huang, Neng-Jye Yang, Li-Min Chen
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Abstract
Embodiments described herein relate generally to methods for forming a conductive feature in a dielectric layer in semiconductor processing and structures formed thereby. In some embodiments, a structure includes a dielectric layer over a substrate, a surface modification layer, and a conductive feature. The dielectric layer has a sidewall. The surface modification layer is along the sidewall, and the surface modification layer includes phosphorous and carbon. The conductive feature is along the surface modification layer.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- depositing a dielectric layer over a conductive region over a semiconductor substrate;
- forming an opening through the dielectric layer to expose the conductive region;
- treating exposed portions of the dielectric layer with a self-limiting reaction to form a monolayer of material, wherein the self-limiting reaction deposits a phosphoric acid derivative material as part of the monolayer of material;
- and
- depositing conductive material within the opening.
A method of manufacturing a semiconductor device, the method comprising:
- forming an opening through a dielectric layer to expose an underlying conductive region;
- replenishing carbon at a surface of the dielectric layer by applying a phosphoric acid derivative to the surface of the dielectric layer;
- and
- filling the opening with a conductive material.
A method of manufacturing a semiconductor device, the method comprising:
- forming an opening through a dielectric layer to expose an underlying conductive region;
- and
- replacing OH groups on a surface of the dielectric layer with a monolayer comprising phosphoric acid derivative molecules, the monolayer having a thickness no thicker than a length of one of the phosphoric acid derivative molecules.
Dependencies are inferred from the claim text.