Die pickup module and die bonding apparatus including the same

A die pickup module comprising:

• a wafer stage for supporting a wafer including dies attached on a dicing tape;
• a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape;
• a non-contact picker for picking up the die from the dicing tape in a non-contact manner so as not to contact a front surface of the die;
• a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker;
• and
• an inverting driving unit for inverting the vacuum gripper to invert the die gripped by the vacuum gripper,
• wherein the die ejector comprises ejector members arranged in a telescope shape and an ejector driving unit for simultaneously raising the ejector members and sequentially descending the ejector members one by one from outside to inside,
• wherein the ejector driving unit comprises,
• disk-shaped flanges formed at a lower end of the ejector members in a horizontal direction, arranged in a vertical direction, and having a diameter gradually increasing upward;
• a driving head arranged in a lower portion of the flanges and having circular ring-shaped upper surfaces respectively facing lower surfaces of the flanges;
• a head driving unit for rotating the driving head;
• and
• cam followers mounted in a lower portion of the flanges and placed on upper surfaces of the driving head,
• wherein the upper surfaces of the driving head include first inclined surfaces for simultaneous raise of the ejector members and second inclined surfaces for sequential descend of the ejector members, and
• wherein the driving head comprises a permanent magnet for providing magnetic force so that the cam followers are in close contact with upper surfaces of the driving head.

A die bonding apparatus comprising:

• a die pickup module for picking up a die to be picked up from a wafer including dies attached on a dicing tape and inverting the picked up die;
• and
• a die bonding module for bonding a die inverted by the die pickup module on a substrate,
• wherein the die pickup module comprises:
• a wafer stage for supporting the wafer;
• a die ejector arranged under the dicing tape and for separating the die from the dicing tape;
• a non-contact picker for picking up the die in a non-contact manner so as not to contact with a front surface of the die;
• a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker, the vacuum gripper including a gripper arm configured in a fork shape, the gripper arm including finger members each having a vacuum hole for vacuum adsorbing rear surface edge portions of the die;
• and
• an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.