Substrate processing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsKihong Cho, Kyuchul Shim, Chungho Cho, Jiho Uh, Jinseok Lee, Namki Cho
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Abstract
A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.
Claims10
A substrate processing apparatus, comprising:
- an electrostatic chuck on which a substrate is mountable;
- a ring surrounding the electrostatic chuck, the ring including a first coupling groove;
- and
- a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape,
- wherein:
- a top surface of the first floating electrode is exposed at the ring,
- the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck,
- the first floating electrode includes a coupling protrusion at a lower portion thereof, and
- the ring includes a protrusion groove under the first coupling groove, the protrusion groove accommodating the coupling protrusion of the first floating electrode.
A substrate processing apparatus, comprising:
- an electrostatic chuck on which a substrate is mountable;
- a first ring surrounding an edge of the electrostatic chuck;
- a second ring surrounding an edge of the first ring, the second ring including a coupling groove and a protrusion groove under the coupling groove;
- and
- a floating electrode in the coupling groove of the second ring, the floating electrode having a ring shape and side surfaces of the floating electrode being surrounded by the second ring,
- wherein:
- a top surface of the floating electrode is exposed at the second ring, and
- the floating electrode includes:
- an inclined portion including an inclined surface that is inclined in a downward direction toward the electrostatic chuck;
- a flat portion outside the inclined portion, the flat portion having a planar surface aligned with a portion of a top surface of the second ring;
- and
- a protrusion portion at a bottom side of the floating electrode, the protrusion portion being in the protrusion groove of the second ring.
A substrate processing apparatus, comprising:
- an electrostatic chuck on which a substrate is mountable;
- a first ring surrounding an edge of the electrostatic chuck;
- a second ring surrounding an edge of the first ring, the second ring including a first coupling groove;
- and
- a first floating electrode in the first coupling groove of the second ring, the first floating electrode having a ring shape.
Dependencies are inferred from the claim text.