Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system

A device, comprising:

• one or more memories;
• and
• one or more processors, communicatively coupled to the one or more memories, configured to:
• detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier;
• cause the semiconductor wafer to rotate with a sorter aligner component of the device;
• cause a coaxial light source, of an automated optical inspection component of the device, to illuminate the semiconductor wafer;
• cause a high-speed camera, of the automated optical inspection component, to capture images of the semiconductor wafer after the coaxial light source illuminates the semiconductor wafer;
• perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged,
• wherein the one or more processors, to perform the image recognition of the images of the semiconductor wafer to determine whether the edge of the semiconductor wafer is damaged, are configured to:
• determine that one or more portions of the edge of the semiconductor wafer are missing,
• calculate one or more sizes associated with the one or more portions, and
• determine that the edge of the semiconductor wafer is damaged when a quantity of the one or more portions satisfies a threshold and at least one size, of the one or more sizes associated with the one or more portions, satisfies a threshold size;
• and
• cause the semiconductor wafer to be selectively provided to the source wafer carrier or the target wafer carrier based on whether the edge of the semiconductor wafer is determined to be damaged,
• wherein the semiconductor wafer is to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and
• wherein the semiconductor wafer is to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.

A non-transitory computer-readable medium storing instructions, the instructions comprising:

• one or more instructions that, when executed by one or more processors of one or more tools, cause the one or more tools to:
• detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier;
• cause a light source to illuminate the semiconductor wafer;
• cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer;
• perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged,
• wherein the one or more instructions, that cause the one or more tools to perform the image recognition of the images of the semiconductor wafer to determine whether the edge of the semiconductor wafer is damaged, cause the one or more tools:
• determine that one or more portions of the edge of the semiconductor wafer are missing,
• calculate one or more sizes associated with the one or more portions, and
• determine that the edge of the semiconductor wafer is damaged when a quantity of the one or more portions satisfies a threshold and at least one size, of the one or more sizes associated with the one or more portions, satisfies a threshold size;
• and
• cause the semiconductor wafer to be selectively provided to the source wafer carrier or the target wafer carrier based on whether the edge of the semiconductor wafer is determined to be damaged,
• wherein the semiconductor wafer is to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged;
• or
• wherein the semiconductor wafer is to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.