Substrate processing method

A substrate processing method performed by using a substrate processing apparatus,

• wherein the substrate processing apparatus comprises:
• a rotary table configured to hold a substrate horizontally and rotate the substrate around a vertical axis;
• an electric heater provided in the rotary table to be rotated along with the rotary table and configured to heat the substrate placed on the rotary table;
• at least one processing nozzle configured to supply a processing liquid onto a front surface of the substrate held on the rotary table;
• and
• a processing liquid supply device configured to supply the processing liquid to the at least one processing liquid nozzle,
• a switch device comprising a power receiving electrode electrically connected to the electric heater and configured to be rotated along with the rotary table, a power feeding electrode configured to be in contact with the power receiving electrode and configured to supply a driving power to the electric heater via the power receiving electrode, and an electrode moving device configured to connect/disconnect the power feeding electrode and the power receiving electrode to/from each other;
• and
• a power feeder configured to supply the driving power to the power feeding electrode,
• wherein the substrate processing method comprises:
• holding the substrate on the rotary table;
• forming, by supplying a chemical liquid as the processing liquid onto a central portion of the substrate while rotating the rotary table at a first speed, a liquid film of the chemical liquid having a first thickness on an entirety of the front surface of the substrate;
• forming, by supplying the chemical liquid onto the central portion of the substrate while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film of the chemical liquid having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness on the entirety of the front surface of the substrate;
• and
• heating, by heating the rotary table with the electric heater in a state that the rotary table is rotated at a third speed equal to or lower than the second speed, in a state that the rotary table is rotated in a rocking manner or in a state that the rotating of the rotary table is stopped after the forming of the liquid film of the chemical liquid having the second thickness, the substrate and the liquid film of the chemical liquid formed on the substrate to thereby accelerate a reaction between the chemical liquid and the front surface of the substrate,
• wherein the forming of the liquid film of the chemical liquid having the first thickness and the forming of the liquid film of the chemical liquid having the second thickness are performed in a state that the power feeding electrode and the power receiving electrode are spaced apart from each other,
• after the forming of the liquid film of the chemical liquid having the second thickness, the rotating of the rotary table is stopped and the power feeding electrode and the power receiving electrode are in contact with each other, and
• the heating of the substrate and the liquid film of the chemical liquid is performed in a state that the power feeding electrode and the power receiving electrode are in contact with each other.