Substrate cleaning method, substrate cleaning system, and storage medium
AssigneeTokyo Electron Limited
InventorMeitoku Aibara
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Abstract
A substrate cleaning method according to an aspect of the present disclosure includes: supplying a film-forming treatment liquid containing a volatile component to a substrate to form a film on the substrate; supplying a peeling treatment liquid, which peels off a treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component; and supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.
Claims8
A substrate cleaning method comprising:
- supplying a film-forming treatment liquid containing a volatile component to a substrate to form a treatment film on the substrate;
- supplying a peeling treatment liquid, which peels off the treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component;
- supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied;
- supplying a rinse liquid to the substrate after the supplying the hydrophobic liquid;
- and
- removing the rinse liquid from the substrate after the supplying the rinse liquid,
- wherein the hydrophobic liquid contains a hydrophobic agent that hydrophobizes the substrate, and an organic solvent, and
- wherein the rinse liquid is the organic solvent.
Dependencies are inferred from the claim text.