Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process

A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:

• forming a mask above the semiconductor wafer, the mask comprising a layer covering and protecting the integrated circuits, and the semiconductor wafer supported by a substrate carrier;
• patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits;
• and
• etching the semiconductor wafer through the gaps in the patterned mask to singulate the integrated circuits while the semiconductor wafer is supported by the substrate carrier, and the substrate carrier is supported by an electrostatic chuck comprising a conductive pedestal having a plurality of notches at a circumferential edge thereof, and an edge insulator ring laterally around the conductive pedestal, the edge insulator ring having a plurality of inner protrusions corresponding to ones of the plurality of notches, each of the plurality of inner protrusions having an opening there through to accommodate corresponding ones of a plurality of lift pins.

A system for dicing a semiconductor wafer comprising a plurality of integrated circuits, the system comprising:

• a factory interface;
• a laser scribe apparatus coupled with the factory interface and comprising a laser;
• and
• an etch apparatus coupled with the factory interface, the etch apparatus comprising a chamber, a plasma source within or coupled to the chamber, and an electrostatic chuck within the chamber, the electrostatic chuck comprising a conductive pedestal having a plurality of notches at a circumferential edge thereof, and a plurality of lift pins corresponding to ones of the plurality of notches, wherein the electrostatic chuck of the etch apparatus further comprises an edge insulator ring laterally around the conductive pedestal, the edge insulator ring having a plurality of inner protrusions corresponding to ones of the plurality of notches, each of the plurality of inner protrusions having an opening there through to accommodate corresponding ones of the plurality of lift pins.

An etch apparatus, comprising

• a chamber;
• a plasma source within or coupled to the chamber;
• and
• an electrostatic chuck within the chamber, the electrostatic chuck comprising:
• a conductive pedestal having a plurality of notches at a circumferential edge thereof;
• a plurality of lift pins corresponding to ones of the plurality of notches;
• and
• a bottom insulator ring beneath the conductive pedestal, the bottom insulator ring having a plurality of openings corresponding to ones of the plurality of lift pins.

A system for dicing a semiconductor wafer comprising a plurality of integrated circuits, the system comprising:

• a factory interface;
• a laser scribe apparatus coupled with the factory interface and comprising a laser;
• and
• an etch apparatus coupled with the factory interface, the etch apparatus comprising a chamber, a plasma source within or coupled to the chamber, and an electrostatic chuck within the chamber, the electrostatic chuck comprising a conductive pedestal having a plurality of notches at a circumferential edge thereof, and a plurality of lift pins corresponding to ones of the plurality of notches, wherein the electrostatic chuck of the etch apparatus further comprises a bottom insulator ring beneath the conductive pedestal, the bottom insulator ring having a plurality of openings corresponding to ones of the plurality of lift pins.