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US 11,600,485 B2Granted
Using sacrificial solids in semiconductor processing
AssigneeMicron Technology, Inc.
InventorsMatthew S. Thorum, Gurtej S. Sandhu
Life of this patent
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Abstract
In an example, a method may include closing an opening in a structure with a sacrificial material at a first processing tool, moving the structure from the first processing tool to a second processing tool while the opening is closed, and removing the sacrificial material at the second processing tool. The structure may be used in semiconductor devices, such as memory devices.
Claims20
A method of forming a semiconductor device, comprising:
- closing openings between a plurality of features in a structure with a sacrificial material at a wet-cleaning tool;
- moving the structure from the wet-cleaning tool to a different tool;
- and
- removing the sacrificial material using a dry process at the different tool.
1 more element
A method of forming a semiconductor device, comprising:
- closing an opening in a structure with a first sacrificial material at a dry removal tool, wherein the opening is formed using the dry removal tool;
- moving the structure from the dry removal tool to a wet-cleaning tool while the opening is closed;
- removing the first sacrificial material and a residue that remains after forming the opening, at the wet-cleaning tool, in a wet-cleaning process using a chemistry of a wet-cleaning process, wherein the first sacrificial material is selected so the sacrificial material is removed by the chemistry of the wet-cleaning process;
- subsequent to removing the first sacrificial material in the wet-cleaning process, closing the opening with a second sacrificial material at the wet cleaning tool;
- moving the structure to a deposition tool;
- and
- removing the second sacrificial material at the deposition tool.
4 more elements
A method of forming a semiconductor device, comprising:
- forming a plurality of features in a structure using a dry removal tool;
- closing openings between each one of the plurality of features with a first sacrificial material at the dry removal tool;
- moving the structure to a wet cleaning tool;
- removing the first sacrificial material using the wet cleaning tool;
- subsequent to removal of the first sacrificial material, closing the openings with a second sacrificial material at the wet cleaning tool;
- moving the structure to a deposition tool;
- removing the second sacrificial material at the deposition tool;
- and
- subsequent to removal of the second sacrificial material, closing the openings with an additional material.
6 more elements
Dependencies are inferred from the claim text.