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US 11,600,484 B2Granted
Cleaning method, semiconductor manufacturing method and a system thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShao-Chi Wei, Hao-Ming Chang
Life of this patent
Estimating the term…
Abstract
A cleaning method applied in semiconductor manufacturing is provided. The method includes: receiving a substrate having a surface; identifying a location of a particle on the surface of the substrate; moving a cleaning apparatus toward the location of the particle; performing a cleaning operation, thereby removing the particle by spraying a cleaning liquid from the cleaning apparatus flowing against gravity and toward the surface of the substrate; detecting the surface of the substrate; and performing a second cleaning operation when a cleaning result of the detection is not acceptable. A semiconductor manufacturing method and a system for cleaning a substrate are also provided.
Claims20
A cleaning method applied in semiconductor manufacturing, comprising:
- providing a substrate, wherein the substrate includes a pellicle and a photomask substrate connected to the pellicle;
- identifying a location of a particle on an outer surface of the pellicle facing away from the photomask substrate;
- moving a cleaning apparatus toward the location of the particle and targeting a peripheral region around the particle on the outer surface;
- performing a first cleaning operation to remove the particle by spraying a cleaning liquid from the cleaning apparatus flowing against gravity and toward the outer surface, while the substrate is motionless held at a position, wherein the cleaning apparatus includes at least one radiation source arranged in a pathway of the cleaning liquid, wherein the cleaning liquid flows through the radiation source and is sprayed out from the cleaning apparatus in a direction opposite to a direction of gravity and in contact with the outer surface at a position adjacent to the location of the particle, and the particle is removed by physical impact of the cleaning liquid from a direction along the outer surface, wherein the first cleaning operation is performed to partially clean the outer surface of the pellicle;
- detecting the surface of the substrate;
- and
- performing a second cleaning operation when a cleaning result of the detection is not acceptable.
4 more elements
A semiconductor manufacturing method, comprising:
- providing a pellicle of a photomask;
- moving a particle recognizer toward a surface of the pellicle to identify a location of a first particle and a location of a second particle on the surface of the pellicle;
- moving a first cleaning apparatus toward the location of the first particle;
- moving a second cleaning apparatus toward the location of the second particle;
- performing a first cleaning operation to remove the first particle by spraying a first cleaning liquid from the first cleaning apparatus flowing against gravity and toward the surface of the pellicle, and performing a second cleaning operation to remove the second particle by spraying a second cleaning liquid from the second cleaning apparatus flowing against gravity and vertically toward the surface of the pellicle, while the photomask is motionless held at a position, wherein the first cleaning apparatus is tilted with respect to the surface, and the first cleaning liquid is sprayed toward an edge of an interface between the surface and the first particle, wherein the first cleaning operation and the second cleaning operation are performed to partially clean the surface of the pellicle;
- and
- transferring a pattern of the photomask to a semiconductor substrate.
4 more elements
A method for manufacturing a semiconductor structure, comprising:
- providing a first cleaning apparatus, a second cleaning apparatus, and a substrate having a first particle and a second particle, wherein the substrate includes a pellicle and a photomask substrate connected to the pellicle, wherein the first particle and the second particle are attached to an outer surface of the pellicle facing away from the photomask substrate;
- moving a particle recognizer toward the outer surface of the pellicle to identify a location of the first particle and a location of the second particle, and to recognize a configuration of the first particle and a configuration of the second particle, wherein the first particle has a flat configuration, and the second particle has a bulging configuration;
- moving the first cleaning apparatus and the second cleaning apparatus toward the location of the first particle and the location of the second particle, respectively, wherein the first particle with flat configuration is targeted by the first cleaning apparatus with a tilt angle, and the second particle with bulging configuration is targeted by the second cleaning apparatus, wherein the second cleaning apparatus is placed perpendicular to the outer surface;
- and
- removing the first particle and the second particle by spraying a first cleaning liquid and a second cleaning liquid respectively from the first cleaning apparatus and the second cleaning apparatus, wherein the first cleaning liquid and the second cleaning liquid are sprayed in a direction opposite to a direction of gravity, the first cleaning liquid is sprayed out from the first cleaning apparatus targeting the location of the first particle, the second cleaning liquid is sprayed out from the second cleaning apparatus targeting the location of the second particle, while the substrate is motionless held at a position, wherein the first cleaning liquid is different from the second cleaning liquid.
2 more elements
Dependencies are inferred from the claim text.