Method for manufacturing a multilayer ceramic electronic component

A method for manufacturing a multilayer ceramic electronic component, the method comprising:

• preparing a plurality of the multilayer bodies each including a plurality of stacked ceramic layers and including a first major surface and a second major surface opposite to each other in a layer stacking direction, a first side surface and a second side surface opposite to each other in a widthwise direction substantially orthogonal to the layer stacking direction, and a first end surface and a second end surface opposite to each other in a lengthwise direction substantially orthogonal to the layer stacking direction and the widthwise direction;
• stacking the plurality of multilayer bodies by adhering a binder between respective major surfaces of at least two of the plurality of the multilayer bodies;
• rotating the stacked plurality of multilayer bodies concurrently by about 90° with the lengthwise direction defining and functioning as an axis of rotation;
• providing a side gap portion on at least a portion of the first side surface or the second side surface of the plurality of multilayer bodies;
• and
• removing the binder from the plurality of multilayer bodies after being provided with the side gap portion to provide the multilayer ceramic electronic component;
• wherein
• the multilayer ceramic electronic component includes a length of a dimension T in the layer stacking direction and a length of a dimension W in the widthwise direction;
• and
• the dimension T is smaller than the dimension W.