Ceramic electronic device and manufacturing method of the same

A ceramic electronic device comprising:

• a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the plurality of dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure, the first end face facing with the second end face,
• wherein a bent portion, in which the plurality of dielectric layers in a substantially same position along a stacking direction project along the stacking direction, is formed in the multilayer chip,
• wherein, in the bent portion, a through-hole is formed in two or more of the plurality of internal electrode layers,
• wherein the through-hole is a defect portion in a first direction in which the first end face faces with the second end face and in a second direction that is vertical to the first direction in a plane of the plurality of internal electrode layers, and
• wherein the through-hole extends to neither an end in the first direction nor an end in the second direction in the two or more of the plurality of internal electrode layers.