Back to results
US 11,600,443 B2Granted
Multilayer electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDong Yeong Kim, Woo Chul Shin, Ji Hong Jo
Life of this patent
Estimating the term…
Abstract
A multilayer electronic component in the example embodiment includes a Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of a body between external electrodes and an extended portion extending from the body covering portion to a region between a plating layer and an additional plating layer of the external electrode, thereby having improved warpage strength and moisture resistance.
Claims21
A multilayer electronic component, comprising:
- a body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween, the body including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces opposing each other and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other and connected to the first to fourth surfaces;
- a first external electrode including a first connection portion disposed on the third surface of the body and a first band portion extending from the first connection portion onto at least a portion of each of the first, second, fifth, and sixth surfaces, wherein each of said first connection portion and said first band portion includes a first electrode layer, a first conductive resin layer, a first plating layer, and a first additional plating layer, arranged in order on an exterior of the body;
- a second external electrode including a second connection portion disposed on the fourth surface of the body and a second band portion extending from the second connection portion onto at least a portion of each of the first, second, fifth, and sixth surfaces, wherein each of said second connection portion and said second band portion includes a second electrode layer, a second conductive resin layer, a second plating layer, and a second additional plating layer, disposed in order on the body;
- and
- an Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of the body between the first and second external electrodes, a first extended portion extending from the body covering portion to a region between the first plating layer and the first additional plating layer of the first band portion, and a second extended portion extending from the body covering portion to a region between the second plating layer and the second additional plating layer of the second band portion,
- wherein the first and second conductive resin layers include a conductive metal and a base resin, wherein the first and second electrode layers include a conductive metal and glass, wherein the first and second plating layers are configured as Ni-plating layers, and the first and second additional plating layers are configured as Sn-plating layers.
3 more elements
A multilayer electronic component, comprising:
- a body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween, the body including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces opposing each other and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other and connected to the first to fourth surfaces;
- a first external electrode including a first electrode layer, a first conductive resin layer, a first plating layer, and a first additional plating layer, arranged in order on an exterior of the body, the first external electrode including a first connection portion disposed on the third surface of the body and a first band portion extending from the first connection portion onto at least a portion of each of the first, second, fifth, and sixth surfaces;
- a second external electrode including a second electrode layer, a second conductive resin layer, a second plating layer, and a second additional plating layer, arranged in order on an exterior of the body, the second external electrode including a second connection portion disposed on the fourth surface of the body and a second band portion extending from the second connection portion onto at least a portion of each of the first, second, fifth, and sixth surfaces;
- an Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of the body between the first and second external electrodes, a first extended portion extending from the body covering portion to a region between the first plating layer and the first additional plating layer, and a second extended portion extending from the body covering portion to a region between the second plating layer and the second additional plating layer;
- and
- first and second openings defined on the first and second extended portions, respectively,
- wherein the first and second conductive resin layers include a conductive metal and a base resin, wherein the first and second electrode layers include a conductive metal and glass, wherein the first and second plating layers are configured as Ni-plating layers, and the first and second additional plating layers are configured as Sn-plating layers.
4 more elements
Dependencies are inferred from the claim text.