InFO coil on metal plate with slot
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
A structure includes an encapsulating material, and a coil including a through-conductor. The through-conductor is in the encapsulating material, with a top surface of the through-conductor coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor coplanar with a bottom surface of the encapsulating material. A metal plate is underlying the encapsulating material. A slot is in the metal plate and filled with a dielectric material. The slot has a portion overlapped by the coil.
Claims20
A structure comprising:
- an encapsulant;
- a device die in the encapsulant;
- through-conductors in the encapsulant, wherein the through-conductors form parts of a coil, and the coil is electrically coupled to the device die;
- a metal plate having a portion overlapped by the coil, wherein the metal plate extends beyond edges of the coil, and wherein the metal plate is electrically insulated from the coil;
- and
- a dielectric region in the metal plate and comprising a portion overlapped by the coil, wherein the dielectric region comprises:
- a strip portion having a uniform first width;
- and
- an enlarged portion joined with the strip portion, wherein the enlarged portion has a second width greater than the uniform first width.
A structure comprising:
- an encapsulant;
- a device die encapsulated by the encapsulant;
- through-conductors encapsulated in the encapsulant, wherein the through-conductors form parts of a coil, and the coil is electrically coupled to the device die;
- a metal plate underlying the coil, wherein the metal plate laterally extends beyond edges of the coil;
- and
- a dielectric material penetrating through the metal plate, wherein the dielectric material comprises:
- a first portion having a lengthwise direction parallel to a first direction, wherein the first portion has a first width;
- and
- a second portion having a second width greater than the first width, wherein the second portion has an end spaced apart from a respective nearest edge of the metal plate, and wherein both of the first width and the second width are measured in a widthwise direction perpendicular to the lengthwise direction.
A structure comprising:
- a molding compound;
- through-conductors encapsulated in the molding compound, wherein the through-conductors form parts of a coil;
- and
- a dielectric region comprising:
- an elongated portion having a uniform width, wherein the elongated portion comprises a first part overlapped by the coil, and a second part extending beyond an outmost edge of the coil;
- and
- an enlarged portion directly underlying the coil, wherein the elongated portion and the enlarged portion are joined with each other.
Dependencies are inferred from the claim text.