Residue free electrically conductive material
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorsBrad L Cumby, Christopher Tabor
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Abstract
A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.
Claims12
A deformable circuit component having electrical properties comprising an electrical element containing microcapsules having electrical properties, wherein the microcapsules comprise a gallium liquid metal alloy core having from about 60 to about 85 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties, said polymeric shell comprising a coating of an electrically conductive material and/or incorporating an electrically conductive material selected from the group consisting of silver particles, gold particles, copper particles, gallium particles, indium particles, gallium/indium alloy particles, mercury particles, aluminum particles, polythiophene, poly(ethylenedioxythiophene), polyaniline, graphene, carbon nanotubes, fullerenes, and mixtures thereof.
Dependencies are inferred from the claim text.