Soldering process parameter suggestion method and system thereof

A soldering process parameters suggesting system, comprising:

• a material component database including at least a first processor and a first storage device and configured to collect solder process related material and component characteristics;
• a working parameter database including at least a second processor and a second storage device and configured to collect operating parameters corresponding to the material and component characteristics in the material component database;
• a soldering process information database including at least a third processor and a third storage device and configured to collect soldering process execution information comprising at least solder temperature profiles, dynamic process images of solder feeding, and dynamic process images of solder heating;
• a final product information database including at least a fourth processor and a fourth storage device and configured to collect solder quality results comprising at least image-inspection tests and electrical tests of solder structure final products, wherein the electrical tests are configured to determine whether the solder structure final products are short-circuited, broken circuit or open circuit;
• a computing device configured to:
• execute a machine learning method to establish relationships between the soldering process execution information and the solder quality results so as to generate a quality prediction model;
• analyze material and component characteristics required for a new soldering process, and compare the material and component characteristics with information in the material component database;
• and
• use the quality prediction model to generate operating parameters corresponding to the material and component characteristics most similar to those required for the new soldering process;
• a soldering machine configured to perform a soldering process using the operating parameters corresponding to the material and component characteristics most similar to those required for the new soldering process;
• and
• a detecting device including at least an image sensor and a temperature sensor and configured to measure and record the soldering process execution information and final product information of the soldering process,
• wherein the computing device is further configured to:
• determine whether a final product of the solder process meets quality control requirements;
• and
• use the machine learning method to fit the soldering process execution information and the final product information of the solder process to get operating parameters for a next soldering process when the final product of the solder process does not meet the quality control requirements.