High-performance computing cooling system

An Information Handling System (IHS), comprising:

• a chassis;
• a processing system that is housed in the chassis;
• a memory system that is housed in the chassis and coupled to the processing system;
• at least one first heat dissipation device that is thermally coupled to the processing system and the memory system and located in the chassis adjacent the processing system and the memory system, and at least one second heat dissipation device that is thermally coupled to the processing system and the memory system and located in the chassis opposite the processing system and the memory system from the at least one first heat dissipation device;
• a first fan device that is located in the chassis adjacent the at least one first heat dissipation device, wherein the first fan device is configured to:
• pull first air from outside of the chassis into the first fan device via at least one first chassis air inlet defined by the chassis;
• push a first portion of the first air past the at least one first heat dissipation device and out of the chassis via a first chassis air outlet defined on a first chassis wall on the chassis;
• and
• push a second portion of the first air past the at least one first heat dissipation device and out of the chassis via a second chassis air outlet defined on a second chassis wall on the chassis that is oriented substantially perpendicularly to the first chassis wall;
• a second fan device that is located in the chassis opposite the processing system and the memory system from the first fan device and adjacent the at least one second heat dissipation device, wherein the second fan device is configured to:
• pull second air from outside of the chassis into the second fan device;
• and
• push the second air past the at least one second heat dissipation device and out of the chassis;
• and
• a third fan device that is located in the chassis opposite the processing system and the memory system from the first fan device and adjacent the at least one second heat dissipation device, wherein the third fan device is configured to:
• pull third air from the outside of the chassis into the third fan device;
• push a first portion of the third air past the at least one second heat dissipation device and out of the chassis;
• and
• push a second portion of the third air into the chassis.

A method for cooling a computing device, comprising:

• pulling, by a first fan device that is located in a chassis adjacent at least one first heat dissipation device that is included in the chassis and that is thermally coupled to at least one heat producing component that is included in the chassis, first air from outside the chassis into the first fan device via at least one first chassis air inlet defined by the chassis;
• pushing, by the first fan device, a first portion of the first air past the at least one first heat dissipation device and out of the chassis via a first chassis air outlet defined on a first chassis wall on the chassis;
• pushing, by the first fan device, a second portion of the first air past the at least one first heat dissipation device and out of the chassis via a second chassis air outlet defined on a second chassis wall on the chassis that is oriented substantially perpendicularly to the first chassis wall;
• pulling, by a second fan device that is located in the chassis opposite the at least one heat producing component from the first fan device and adjacent at least one second heat dissipation device that is thermally coupled to the at least one heat producing component, second air from outside the chassis into the second fan device;
• pushing, by the second fan device, the second air past the at least one second heat dissipation device and out of the chassis;
• pulling, by a third fan device that is located in the chassis opposite the at least one heat producing component from the first fan device and adjacent the at least one second heat dissipation device, second air from the outside of the chassis into the second fan device;
• pushing, by the third fan device, a first portion of the third air past the at least one second heat dissipation device and out of the chassis;
• and
• pushing, by the third fan device, a second portion of the third air into the chassis.