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US 11,599,032 B2Granted
Dynamic generation of layout adaptive packaging
AssigneeApplied Materials, Inc.
InventorsUwe Hollerbach, Thomas L. Laidig
Life of this patent
Estimating the term…
Abstract
Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.
Claims20
A method for processing an apparatus in a maskless lithography system, comprising:
- obtaining coordinate data on a component and an aspect of an electrical connection to the component in a designed state;
- placing the component within range of at least one scanning device associated with the lithography system;
- scanning the component with the at least one scanning device to develop a second set of coordinate data for the component;
- comparing the obtained coordinate data of the component to the second set of coordinate data for the component to determine an offset of the component scanned with the scanning device to the designed state;
- altering the aspect of the electrical connection to the component based, at least in part, upon one of the offset data, visual images of the scanning of the component used to develop the second set of coordinate data for the component, and the second set of coordinate data for the component prior to the forming the electrical connection;
- providing an electrical connection wiring location between the component and a fixed perimeter using the altered aspect of the electrical connection;
- and
- forming an altered electrical connection on the electrical connection location between the component and the fixed perimeter, wherein the method is performed in-situ in the maskless lithography system.
5 more elements
A method for processing an apparatus in a maskless microlithography system, comprising:
- obtaining position data on a component and an aspect of an electrical connection to the component for a designed state;
- placing the component on a stage of a microlithography system;
- placing the stage within range of at least one scanning device of the microlithography system;
- scanning the stage including the component with the at least one scanning device to develop a second set of coordinate data for the component and the electrical connection;
- comparing the obtained coordinate data of the component to the second set of coordinate data for the component to determine an offset of the component scanned with the scanning device to the designed state;
- altering the aspect of the electrical connection to the component based, at least in part, upon the offset data prior to forming the electrical connection;
- providing an electrical connection wiring location between the component and a fixed perimeter using the altered aspect of the electrical connection;
- and
- forming the altered electrical connection on the electrical connection location between the component and the fixed perimeter, wherein the method is performed in-situ in the maskless lithography system.
6 more elements
A method for processing a substrate in a maskless microlithography system, comprising:
- obtaining coordinate data in a designed state pertaining to at least one component and an aspect of at least one wiring connection to the at least one component, wherein the component is at least one of on and in the substrate;
- placing the substrate on a stage within the microlithography system;
- moving the substrate on the stage to a scanning device of the lithography system;
- scanning the substrate including the component with the scanning device to develop a second set of coordinate data for the component;
- comparing the obtained coordinate data of the component of the stage to the second set of coordinate data for the component to determine an offset of the component scanned with the scanning device to the designed state;
- altering the aspect of the at least one wiring connection to the component based, at least in part, upon one of the offset data, visual images of the scanning of the component used to develop the second set of coordinate data for the component and the second set of coordinate data for the component prior to forming the electrical connection;
- providing an electrical connection wiring location between the component and a fixed perimeter using the altered aspect of the electrical connection;
- and
- forming the altered electrical connection on the electrical connection location between the component and the fixed perimeter, wherein the method is performed in-situ in the maskless lithography system.
6 more elements
Dependencies are inferred from the claim text.