Dispensing nozzle design and dispensing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei Chang Cheng, Chi-Hung Liao
Life of this patent
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Abstract
A method of dispensing a fluid in a semiconductor manufacturing process includes providing a substrate, positioning a nozzle above the substrate, and determining a cross-sectional shape of the nozzle. The method also includes configuring the nozzle to have the determined cross-sectional shape and applying the fluid to the substrate through the nozzle with the determined cross-sectional shape.
Claims20
A method of dispensing a fluid in a semiconductor manufacturing process, comprising:
- providing a substrate;
- positioning a nozzle above the substrate, wherein an end of the nozzle is an opening directly facing the substrate, the opening at the end of the nozzle having an initial cross-sectional profile;
- determining an adjusted cross-sectional profile of the opening, the adjusted cross-sectional profile being different from the initial cross-sectional profile;
- configuring the nozzle to transit the opening at the end of the nozzle from the initial cross-sectional profile to the adjusted cross-sectional profile;
- and
- applying the fluid to the substrate through the nozzle with the adjusted cross-sectional profile of the opening.
A method of dispensing a fluid in a semiconductor manufacturing process, comprising:
- securing a substrate on a chuck;
- positioning a nozzle above the substrate, the nozzle having an initial cross-sectional shape, the nozzle being attached to a moveable arm operable to move the nozzle horizontally and vertically with respect to the substrate during the dispensing of the fluid;
- applying a mechanical force on an outer surface of the nozzle, such that the nozzle having an adjusted cross-sectional shape that is different from the initial cross-sectional shape;
- and
- flowing the fluid through the nozzle towards the substrate while the substrate spins, such that the fluid forms a coating layer fully covering the substrate.
A method of dispensing a fluid, comprising:
- providing a substrate;
- positioning a nozzle above the substrate;
- driving a plurality of moveable pins towards and in contact with an outer surface of the nozzle to change a cross-sectional profile of the nozzle, wherein the moveable pins are configurable to retreat from the outer surface to be free of contact with the outer surface;
- positioning a gas sprayer in a proximate region of the nozzle;
- flowing the fluid to the substrate through the nozzle;
- and
- blowing an inert gas through the gas sprayer towards the nozzle, thereby changing an ambient pressure in the proximate region of the nozzle and consequently changing a flying path of the fluid leaving the nozzle.
Dependencies are inferred from the claim text.