Back to results
US 11,599,021 B2Granted
Photoresist compositions and methods for fabricating semiconductor devices using the same
AssigneesSamsung Electronics Co., Ltd., Inpria Corporation
InventorsChawon Koh, Tsunehiro Nishi, Brian Cardineau, Sangyoon Woo, Jason Stowers, Soo Young Choi
Life of this patent
Estimating the term…
Abstract
Provided herein are photoresist compositions and methods for fabricating semiconductor devices using the same. A photoresist composition may include an organometallic material, a fluorine-containing material, and an organic solvent.
Claims8
A method for fabricating a semiconductor device, the method comprising:
- providing a photoresist composition including an organometallic material, a fluorine-containing material, and an organic solvent;
- forming a photoresist film by coating a substrate with the photoresist composition, wherein the photoresist film includes a photosensitive film and a moisture barrier layer on the photosensitive film, wherein the photosensitive film comprises the organometallic material and the moisture barrier layer comprises the fluorine-containing material;
- evaporating the organic solvent using a soft bake process;
- converting a portion of the photosensitive film into a mask pattern using an exposure process and a post bake process;
- and
- removing the photosensitive film and leaving the mask pattern using a development process.
3 more elements
A method for fabricating a semiconductor device, the method comprising:
- forming a photosensitive film and a moisture barrier layer on a substrate, wherein the photosensitive film and the moisture barrier layer are sequentially stacked on the substrate;
- converting a portion of the photosensitive film into a mask pattern using an exposure process and a post bake process;
- and
- removing the photosensitive film and leaving the mask pattern using a development process.
1 more element
Dependencies are inferred from the claim text.