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US 11,598,830 B1Granted
TMR assembly having a heat sink
AssigneeAllegro MicroSystems, LLC
InventorsSundar Chetlur, Maxim Klebanov, Yen Ting Liu, Paolo Campiglio
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Abstract
Methods and apparatus for a sensor including a series of tunneling magnetoresistance (TMR) pillars and a heatsink adjacent to at least one of the TMR pillars, where the heatsink comprises Titanium Nitride (TiN).
Claims16
A sensor, comprising:
- a series of tunneling magnetoresistance (TMR) pillars;
- a heatsink adjacent to at least one of the TMR pillars, wherein the heatsink comprises Titanium Nitride (TiN);
- a first series of vias from ones of the TMR pillars to a first layer of TiN to provide a thermal path to a substrate;
- and
- a second series of vias from the first layer of TiN to a second layer of TiN.
2 more elements
A method, comprising:
- employing a series of tunneling magnetoresistance (TMR) pillars in a sensor;
- employing a heatsink adjacent to at least one of the TMR pillars, wherein the heatsink comprises Titanium Nitride (TiN);
- employing a first series of vias from ones of the TMR pillars to a first layer of TiN to provide a thermal path to a substrate;
- and
- employing a second series of vias from the first layer of TiN to a second layer of TiN.
2 more elements
Dependencies are inferred from the claim text.