Test system and probe device

A test system which electrically connects one or more first semiconductor chips formed on a first wafer and one or more second semiconductor chips formed on a second wafer to test the one or more first semiconductor chips and the one or more second semiconductor chips, the test system comprising:

• a test device configured to supply a test signal to each of the one or more first semiconductor chips;
• at least one first probe device comprising a first probe to be connected to at least one first internal pad of each of the one or more first semiconductor chips and a first communication circuit configured to transmit and receive a signal;
• and
• at least one second probe device comprising a second probe to be connected to at least one second internal pad of each of the one or more second semiconductor chips and a second communication circuit configured to transmit and receive the signal to and from the first communication circuit, wherein
• the first probe device comprises a first signal generation circuit configured to convert a signal captured from the first internal pad via the first probe into the signal which can be transmitted by the first communication circuit and the second communication circuit, and
• the second probe device comprises a second signal generation circuit configured to return the signal received by the second communication circuit into a signal before being converted by the first signal generation circuit and provide the returned signal to the second internal pad via the second probe.