Probe systems configured to test a device under test and methods of operating the probe systems

A probe system configured to test a device under test (DUT), the probe system comprising:

• an electromagnetically shielded enclosure that defines an enclosed volume;
• a temperature-controlled chuck that defines a support surface configured to support a substrate that includes the DUT, wherein the support surface is positioned within the enclosed volume;
• a probe assembly including a plurality of probes configured to at least one of provide a test signal to the DUT and receive a resultant signal from the DUT;
• an optical microscope configured to collect a microscope optical image of the DUT along a microscope optical axis that is directed toward the support surface;
• an electromagnet configured to selectively apply a magnetic field to the DUT;
• and
• an electronically controlled positioning assembly including:
• (i) a two-dimensional positioning stage configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis that is at least substantially perpendicular to the first two-dimensional positioning axis, wherein both the first two-dimensional positioning axis and the second two-dimensional positioning axis are at least substantially parallel to the support surface;
• (ii) a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and is configured to selectively position the optical microscope along a first one-dimensional positioning axis that is at least substantially perpendicular to the support surface;
• and
• (iii) a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioned assembly and is configured to selectively position the electromagnet along a second one-dimensional positioning axis that is at least substantially perpendicular to the support surface.