Tungsten-rhenium composite thin film thermocouple based on surface micropillar array with gas holes

A tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes, comprising:

• a flat alumina ceramic substrate;
• and
• a tungsten-rhenium thin film thermocouple;
• wherein the tungsten-rhenium thin film thermocouple is arranged on a surface of the flat alumina ceramic substrate;
• a first tail of the tungsten-rhenium thin film thermocouple is connected to a first lead wire, and a second tail of the tungsten-rhenium thin film thermocouple is connected to a second lead wire;
• a surface of the tungsten-rhenium thin film thermocouple is provided with a plurality of micron alumina micropillars to form an alumina micropillar array;
• a height of each of the plurality of micron alumina micropillars is 5 μm±8%;
• air is filled in a space between adjacent micron alumina micropillars to form the gas holes;
• the flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure;
• each of the plurality of micron alumina micropillars comprises a first cylinder and a second cylinder;
• one end of the second cylinder is connected to the tungsten-rhenium thin film thermocouple;
• and a diameter of the first cylinder is larger than that of the second cylinder.