Micropillar-enabled thermal ground plane

A thermal ground plane comprising:

• a first substrate member comprising copper and either stainless steel or polymer;
• a second substrate member comprising a metal, wherein a perimeter of the first substrate member and a perimeter of the second substrate member are hermetically sealed together, wherein the first substrate member and the second substrate member enclose a working fluid;
• a mesh layer bonded with the first substrate member, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper;
• a plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the plurality of pillars extend from the second substrate member to the mesh layer and are not in contact with the first substrate member;
• and
• a third plurality of pillars that extend from the first substrate member to the second substrate member.

A thermal ground plane comprising:

• a first substrate member comprising copper;
• a second substrate member comprising a metal, wherein the first substrate member and the second substrate member enclose a working fluid;
• a mesh layer bonded with the first substrate member, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper;
• a second plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the second plurality of pillars extend from the second substrate member to the mesh layer and are not in contact with the first substrate member;
• and
• a third plurality of pillars that extend from the first substrate member to the second substrate member.

A thermal ground plane comprising:

• a first substrate member comprising copper;
• a second substrate member comprising a metal, wherein the first substrate member and the second substrate member enclose a working fluid;
• a mesh layer bonded with the first substrate member, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper;
• a second plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the second plurality of pillars extend from the second substrate member to the mesh layer;
• and
• a third plurality of pillars that extend from the first substrate member to the second substrate member.