Dual wafer plating fixture for a continuous plating line

A wafer plating fixture for use in simultaneously electroplating two substrates, the wafer plating fixture comprising:

• an electrically conductive carrier bus having a front surface and a back surface;
• a plurality of contact clips electrically coupled to the electrically conductive carrier bus, wherein the plurality of contact clips are distributed on the front surface and the back surface of the electrically conductive carrier bus and configured to electrically couple the two substrates to the front surface of the electrically conductive carrier bus, wherein each of the plurality of contact clips is symmetric about the front surface and the back surface of the electrically conductive carrier bus, and wherein each of the plurality of contact clips comprises a conductive material having a non-conductive coating thereon;
• and
• a non-conductive substrate backer coupled to the electrically conductive carrier bus and configured to separate the two substrates, wherein the non-conductive substrate backer comprises a top portion that extends along a bottom edge portion of the electrically conductive carrier bus and two or more distal extensions that extend from the top portion of the non-conductive substrate backer, wherein the distal extensions are configured to keep the two substrates from contacting.