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US 11,598,017 B2Granted
Method of plating
AssigneeEbara Corporation
InventorsShoichiro Ogata, Gaku Yamasaki
Life of this patent
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Abstract
There is provided a method of plating comprising: a process of bringing a sealing portion of a seal provided to prevent a contact of a substrate holder that holds a substrate from coming into contact with a plating solution, into contact with pure water; and a process of detecting a leak of the seal, based on presence or absence of a short circuit of a leak detection electrode placed inside of the substrate holder after the sealing portion is brought into contact with the pure water and before the substrate is brought into contact with a chemical solution.
Claims8
A method of plating, comprising
- a process of bringing a sealing portion of a seal into contact with pure water, the seal preventing a contact of a substrate holder that holds a substrate from coming into contact with a plating solution;
- and
- a process of detecting a leak of the seal based on presence or absence of a short circuit of a leak detection electrode placed inside of the substrate holder, the process of detecting occurring after the sealing portion is brought into contact with the pure water and before the substrate is brought into contact with the plating solution
- wherein the leak detection electrode is placed in a neighborhood of a conductive member for substrate electric conduction in order to be electrically insulated from the conductive member, and
- the process of detecting the leak of the seal detects the leak of the seal by utilizing a short circuit between the leak detection electrode and the conductive member caused by presence of pure water.
2 more elements
Dependencies are inferred from the claim text.