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US 11,597,896 B2Granted
Cleaning liquid, cleaning method, and method for producing semiconductor wafer
AssigneeMitsubishi Chemical Corporation
InventorsToshiaki Shibata, Yasuhiro Kawase, Ken Harada, Atsushi Ito, Tomohiro Kusano, Yutaro Takeshita
Life of this patent
Estimating the term…
Abstract
The present invention relates to a cleaning liquid containing a component (A): a compound represented by the following formula (1), component (B): alkylamine, component (C): polycarboxylic acid, and component (D): ascorbic acid, in which a mass ratio of the component (A) to a total mass of the component (B) and the component (C) is 1 to 15, and in the formula (1), R1, R2, and R3 each have a definition same as the definition described in the description,
Claims13
A cleaning liquid comprising the following component (A) to component (D), wherein
- a mass ratio of the component (A) to a total mass of the component (B) and the component (C) is 1 to 15:
- component (A):
- a compound represented by the following formula (1);
- in the formula (1), R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R2 represents a carboxyl group, a carbonyl group, a functional group having an ester bond, a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R3 represents an acetyl group, a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
- component (B):
- an alkylamine;
- component (C):
- a polycarboxylic acid;
- and
- component (D):
- an ascorbic acid.
8 more elements
Dependencies are inferred from the claim text.