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US 11,597,837 B2Granted
Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same
AssigneeLG Chem, Ltd.
InventorsChangbo Shim, Yongseon Hwang, Hwayeon Moon, Hee Yong Shim, Hyunsung Min
Life of this patent
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Abstract
The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.
Claims13
A thermosetting resin composition comprising:
- a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof;
- a thermosetting resin comprising at least one resin selected from the group consisting of bismaleimide resin and bismaleimide-triazine resin, and at least one epoxy resin selected from the group consisting of bisphenol A type epoxy resin, phenol novolac epoxy resin, tetraphenyl ethane epoxy resin, naphthalene-based epoxy resin, biphenyl-based epoxy resin, dicyclopentadiene epoxy resin, and a mixture of dicyclopentadiene-based epoxy resin and naphthalene-based epoxy resin;
- one or more elastic co-polymer or homo-polymer selected from the group consisting of a) a styrene-butadiene/butylene-styrene block co-polymer containing styrene in an amount of 10 to 70% by weight, and b) a cyanate ester containing polybutadiene rubber, polydimethylsiloxane or fluorinated thermoplastic resin in a molecule;
- and
- an inorganic filler.
2 more elements
Dependencies are inferred from the claim text.