Right-sized thermoformed cavities for packaging items
AssigneeAmazon Technologies, Inc.
InventorsBrian Stuart Hoffman, Cory Richard Boudreau, Todd Ethan Brunner, David C. Franchino, Alexandra Kay Hartford, Vivian Lin, Mohan Mahadevan, John Gaetano Matrecano, Alexandra Surasky-Ysasi, Timothy Alan Talda
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