Thin-layer tape automated lamination method and device
AssigneeFukui Prefectural Government
InventorsKazumasa Kawabe, Kohei Yamada, Keiichi Kondo, Hirofumi Iyo, Shin Kaechi
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Abstract
The present invention is intended to provide automated lamination method and device that can efficiently perform automated lamination by using a thin-layer tape. A thin-layer tape automated lamination device 1 includes a provisional formation unit 2 configured to form lamination tapes having thicknesses different from each other by laminating a plurality of thin-layer tapes each having a thickness of 5 μm to 80 μm, and a lamination-shaping unit 3 configured to laminate and shape each formed lamination tape in a lamination region of a basal body surface.
Claims4
A thin-layer tape automated lamination method comprising:
- a provisional formation step of forming lamination tapes having thicknesses different from each other by laminating a plurality of thin-layer prepreg tapes each having a thickness of 20 μm to 80 μm in a resin impregnation state, the plurality of thin-layer prepreg tapes including a base thin-layer pre-preg tape and a plurality of other thin-layer pre-preg tapes;
- a conveyance process of conveying a formed lamination tape of the lamination tapes;
- and
- a lamination-shaping step of laminating and shaping the conveyed lamination tape in a lamination region of a basal body surface,
- wherein the provisional formation step forms the lamination tape by cutting sheets of the other thin-layer prepreg tapes to the same or different lengths, and laminating the cut other thin-layer prepreg tapes on the base thin-layer prepreg tape.
Dependencies are inferred from the claim text.