Polishing pad, method for manufacturing polishing pad, and polishing method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Hao Huang, Hsuan-Pang Liu, Yuan-Chun Sie, Pinyen Lin, Cheng-Chung Chien
Life of this patent
Estimating the term…
Abstract
A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.
Claims20
A method for manufacturing a polishing pad for attachment to a platen, comprising:
- forming a polishing layer having a top surface, wherein the forming the polishing layer comprises defining a first cavity;
- and
- bonding the polishing layer onto a support layer defining a recess such that the first cavity overlies the recess, wherein the top surface of the polishing layer faces away from the support layer after the bonding and the first cavity is buried beneath the top surface of the polishing layer after the bonding and upon the polishing pad being attached to the platen, the platen is closer to the support layer than to the polishing layer.
A method for manufacturing a polishing pad, comprising:
- forming a polishing layer having a top surface and a bottom surface, wherein the forming the polishing layer comprises defining a plurality of first cavities disposed between the top surface of the polishing layer and the bottom surface of the polishing layer such that two adjacent cavities of the plurality of first cavities have a uniform height measured between the top surface of the polishing layer and the bottom surface of the polishing layer and such that a solid portion is disposed between the top surface of the polishing layer and a cavity of the plurality of first cavities;
- forming a second polishing layer over the polishing layer, wherein a second cavity is defined by the second polishing layer;
- and
- bonding the polishing layer onto a support layer, wherein the top surface of the polishing layer faces away from the support layer.
A method for manufacturing a polishing pad, comprising:
- forming a polishing layer having a top surface, wherein the forming the polishing layer comprises defining a first row of cavities and a second row of cavities;
- and
- bonding the polishing layer onto a support layer defining one or more recesses such that at least some cavities in the first row of cavities overlie at least some recesses of the one or more recesses, wherein the top surface of the polishing layer faces away from the support layer after the bonding and the first row of cavities and the second row of cavities are buried beneath the top surface of the polishing layer after the bonding and upon the polishing pad being attached to a platen, the platen is closer to the support layer than to the polishing layer.
Dependencies are inferred from the claim text.