Temperature control of chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsHari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj, Andrew Siordia
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Abstract
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.
Claims17
A chemical mechanical polishing apparatus comprising:
- a platen to hold a polishing pad;
- a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
- a dispenser to supply a polishing liquid to the polishing surface;
- a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface, the body supporting a thermal control module positioned over the polishing pad, wherein the thermal control module comprises a stack including a thermoelectric heat pump and a heat exchanger;
- and
- an actuator to adjust a vertical position of the body relative to the polishing pad.
A chemical mechanical polishing apparatus comprising:
- a platen to hold a polishing pad;
- a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
- a temperature control system including a plurality of thermal control modules positioned above the polishing pad, each thermal control module including a stack including a thermoelectric heat pump and a heat exchanger having a passage to receive a fluid and exchange heat between the polishing pad and the fluid, the temperature control system further including a plurality of fluid circulators to supply fluid at two different temperatures, and a plurality of valves to selectively fluidically couple each of the plurality of fluid circulators to each of the heat exchangers.
Dependencies are inferred from the claim text.