Method for polishing substrate including functional chip
AssigneeEbara Corporation
InventorsTetsuji Togawa, Hiroshi Sobukawa, Masahiro Hatakeyama
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Abstract
To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.
Claims11
A method for chemomechanically polishing a substrate including a functional chip, the method comprising:
- a step of disposing the functional chip on the substrate;
- a step of disposing an end point sensing element on the substrate;
- a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material;
- a step of forming a barrier mold layer on the insulating material;
- and
- a step of forming a metal layer on the barrier mold layer;
- a step of polishing the insulating material;
- and
- a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished,
- when the metal layer is polished, the end point of the polishing is sensed based on at least one of:
- (1) a change in eddy current by an eddy current sensor;
- (2) a change in reflected light from the metal layer by an optical sensor;
- and
- (3) a change in polishing resistance.
A method for chemomechanically polishing a substrate including a functional chip, wherein
- the functional chip and an end point sensing element are disposed on the substrate, and the substrate is in a state of sealed with an insulating material, and
- the substrate is in a state where a barrier mold layer is formed on the insulating material and further a metal layer is formed on the barrier mold layer,
- the method comprises:
- a step of polishing the insulating material;
- and
- a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished,
- when the metal layer is polished, the end point of the polishing is sensed based on at least one of:
- (1) a change in eddy current by an eddy current sensor;
- (2) a change in reflected light from the metal layer by an optical sensor;
- and
- (3) a change in polishing resistance.
A method for chemomechanically polishing a substrate including a functional chip sealed with an insulating material, the method comprising:
- a step of irradiating the substrate with light such that the light is totally reflected by a surface of the substrate;
- a step of receiving light totally reflected by the surface of the substrate;
- and
- a step of determining an end point of the polishing of the substrate based on a change in the received light.
Dependencies are inferred from the claim text.