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US 11,597,042 B2Granted
Printable surface treatment for aluminum bonding
AssigneeAveratek Corporation
InventorsMichael Riley Vinson, Calvin Chen, Divyakant P Kadiwala, Sunity K Sharma
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Abstract
Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.
Claims15
A method of bonding a copper metal to aluminum, comprising:
- depositing a printable composition on the copper metal to form a coated copper surface, wherein the printable composition comprises (i) an aqueous solvent or a mixed aqueous solvent, ii) a fatty acid and (iii) an organic amine, and wherein the printable composition does not include a metal, wherein the copper metal is brought into near contact with an aluminum surface before the step of depositing the printable composition;
- and
- coupling the coated copper surface directly to the aluminum surface, wherein at least one of the copper surface or the aluminum surface comprises part of an electronic component.
Dependencies are inferred from the claim text.