Optical module and manufacturing method thereof
AssigneeFujitsu Optical Components Limited
InventorsKohei Shibata, Tatsuya Ito
Life of this patent
Estimating the term…
Abstract
An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.
Claims14
An optical module comprising:
- an optical semiconductor chip having an upper surface formed with an optical device, and a side surface provided along one end in a thickness direction of the optical semiconductor chip;
- an optical fiber optically coupled to the side surface from an outer side of the optical semiconductor chip;
- and
- a support member having a bonding surface bonded to the side surface from the outer side of the optical semiconductor chip, and configured to support the optical fiber,
- wherein the side surface includes a laser beam irradiated surface and a cleavage surface,
- wherein the cleavage surface has a first surface roughness smaller than a second surface roughness of the laser beam irradiated surface,
- wherein the optical semiconductor chip has an optical signal input and output part located at the cleavage surface, and
- wherein the bonding surface of the support member is bonded to an area of the cleavage surface smaller than an entire area of the cleavage surface.
A manufacturing method to manufacture an optical module, comprising:
- preparing an optical semiconductor chip having an upper surface formed with an optical device, and a side surface provided along one end in a thickness direction of the optical semiconductor chip, wherein the side surface includes a laser beam irradiated surface and a cleavage surface, and the cleavage surface has a first surface roughness smaller than a second surface roughness of the laser beam irradiated surface;
- preparing an optical fiber supported by a support member having a bonding surface;
- and
- bonding the bonding surface to and inside an area of the cleavage surface of the side surface smaller than an entire area of the cleavage surface, to optically couple the optical fiber to the side surface from an outer side of the optical semiconductor chip.
Dependencies are inferred from the claim text.