Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorsHui Xu, Wei Qin, D. Matthew Odhner
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Abstract
A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
Claims34
A method of operating a wire bonding machine, the method comprising the steps of:
- (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine;
- and
- (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) the automatic wire bonding operation and (ii) the dry cycle wire bonding operation.
A method of operating a wire bonding machine, the method comprising the steps of:
- (a) incrementally adjusting a bonding force applied to a bond head assembly while detecting a z-height position of a portion of the bond head assembly;
- and
- (b) determining a desired bonding force at which an incremental adjustment from step (a) does not result in a change of the z-height position of the bond head assembly.
A method of operating a wire bonding machine, the method comprising the steps of:
- (a) incrementally adjusting a bonding force applied to a bond head assembly while detecting a z-height position of a portion of the bond head assembly;
- and
- (b) determining a desired bonding force at which an incremental adjustment from step (a) results in a peak z-height position of the bond head assembly.
Dependencies are inferred from the claim text.