Biofilm resistant medical implant

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• etching the outer surface using a fluoride solution;
• after etching the outer surface, depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein at least about 20 percent, by area fraction, of the silver deposited on the surface of the substrate remains on the surface after said diffusing.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• after said diffusing, removing excess silver or copper on the outer surface by chemical or mechanical means;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• after said diffusing, exposing the outer surface to an oxygen ion implantation treatment;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein said oxidizing or anodizing comprises a thermal oxidation conducted at a temperature between about 500 and about 1000° C. for at least 1 hour.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein said oxidizing or anodizing comprises anodizing the surface in a bath of ammonium sulfate at a voltage between about 10 and about 150 V for at least 10 seconds.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising,

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• after said depositing wrapping the implant in silver foil;
• after wrapping the implant in silver foil, diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein said depositing comprises wrapping the implant in silver foil.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein said diffusing is conducted in air.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein said diffusing comprises heating at a temperature of from about 500° C. to about 800° C.

A method of incorporating silver, copper or both silver and copper into a metallic biomedical implant, comprising:

• providing an implant comprising a biomedical metal or a biomedical alloy having an outer surface;
• depositing silver, copper or both silver and copper onto the outer surface;
• diffusing silver, copper or both silver and copper into the biomedical metal or biomedical alloy beneath the outer surface by heating the implant;
• and
• oxidizing or anodizing the outer surface after said diffusing to form an oxidized or anodized layer;
• wherein said diffusing comprises heating at a temperature of from about 650° C. to about 800° C. for a period of time of about 15 minutes to about 10 hours.