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US 11,596,719 B2Granted
Adhesion prevention film for medical devices and medical device
AssigneeOlympus Corporation
InventorsYu Murano, Takuya Fujihara, Takeshi Deguchi, Hiroaki Kasai, Kohei Shiramizu
Life of this patent
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Abstract
This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.
Claims10
A medical device comprising:
- an electrode;
- and
- an adhesion prevention film provided on a surface of the electrode, the adhesion prevention film comprising:
- one or more layers;
- wherein an outermost layer of the one or more layers contains a resin with a continuously usable temperature of at least 200° C., and a plurality of conductive particles;
- wherein a surface of the outermost layer is provided with recesses and projections formed by some of the plurality of conductive particles being exposed from the resin;
- wherein the plurality of conductive particles include:
- a first conductive particle group having a median diameter that is in a range of from 1 μm to 20 μm;
- and
- a second conductive particle group having a median diameter that is in a range of 0.01 μm to 0.5 μm;
- and
- wherein particles in the first conductive particle group and the second conductive particle group are provided in the outermost layer in amounts such that the outermost layer has electrical conductivity.
9 more elements
Dependencies are inferred from the claim text.