Intraluminal ultrasound imaging device and method of fabricating the same
AssigneePhilips Image Guided Therapy Corporation
InventorJun Song
Life of this patent
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Abstract
Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.
Claims18
An intraluminal ultrasound imaging device, comprising:
- a flexible elongate member configured to be positioned within a body lumen of a patient;
- and
- an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen, the ultrasound scanner assembly comprising:
- a flexible substrate,
- a conductive layer over the flexible substrate,
- a first polymer insulation portion and a second polymer insulation portion over the conductive layer, wherein a space between the first polymer insulation portion and the second polymer insulation portion exposes a first contact area of the conductive layer,
- a first under-bump metallization (UBM) layer over the first contact area,
- a first solder feature over the first UBM layer, wherein the first UBM layer and the first solder feature are disposed between the first polymer insulation and the second polymer insulation portion, and
- a first electronic component electrically connected to the first solder feature.
A method for fabricating an intraluminal ultrasound scanner assembly, comprising:
- providing a flexible circuit structure, the flexible circuit structure comprising:
- a flexible substrate,
- a conductive layer over the flexible substrate,
- a first polymer insulation portion and a second polymer insulation portion over the conductive layer, wherein a space between the first polymer insulation portion and the second polymer insulation portion exposes a contact area of the conductive layer,
- an under-bump metallization (UBM) layer over the contact area, and
- a solder feature over the UBM layer, wherein the UBM layer and the solder feature are disposed between the first polymer insulation and the second polymer insulation portion;
- applying a solder flux over the solder feature;
- placing an ultrasound transducer over the flexible circuit structure such that a contact pad of the ultrasound transducer is aligned and in contact with the solder feature;
- and
- performing a first reflow soldering process to the flexible circuit structure to bond the contact pad and the solder feature.
Dependencies are inferred from the claim text.