Optoelectronic sensor module and method for producing an optoelectronic sensor module

A method for producing an optoelectronic sensor module comprising a first semiconductor transmitter chip configured to emit radiation of a first wavelength, a second semiconductor transmitter chip configured to emit radiation of a second wavelength different from the first wavelength, a semiconductor detector chip configured to detect the radiation of the first and second wavelengths, and a potting body, which is opaque to the radiation of the first and second wavelengths, and which directly covers side surfaces of the chips and mechanically connects the chips located in a common plane to one another, wherein a distance between the chips is less than or equal to twice an average diagonal length of the chips and wherein the sensor module is adapted to rest against a body part to be examined, the method comprising:

• providing the chips;
• encapsulating the chips so that the potting body is formed;
• and
• applying optics to the potting body including the chips,
• wherein the optics are glued onto the potting body before forming a further potting body,
• wherein each side surface of the optics is directly and completely covered by a material of the further potting body when the further potting body is formed,
• wherein each optics is in a one-to-one correspondence with one of the chips, and
• wherein at least one of the optics is formed by a multiple lens array.

A method for producing an optoelectronic sensor module comprising a first semiconductor transmitter chip configured to emit radiation of a first wavelength, a second semiconductor transmitter chip configured to emit radiation of a second wavelength different from the first wavelength, a semiconductor detector chip configured to detect the radiation of the first and second wavelengths, and a potting body, which is opaque to the radiation of the first and second wavelengths, and which directly covers side surfaces of the chips and mechanically connects the chips located in a common plane to one another, wherein a distance between the chips is less than or equal to twice an average diagonal length of the chips and wherein the sensor module is adapted to rest against a body part to be examined, the method comprising:

• providing the chips;
• encapsulating the chips so that the potting body is formed;
• and
• forming a further potting body so that each lateral surface of optics is directly and completely covered by a material of the further potting body,
• wherein the further potting body with the integrated optics is glued onto the potting body over an entire surface,
• wherein each optics is in a one-to-one correspondence with one of the chips, and
• wherein at least one of the optics is formed by a multiple lens array.