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US 11,596,066 B1Granted
Materials for printed circuit boards
AssigneeThintronics, Inc.
InventorsTarun Amla, Stefan J. Pastine
Life of this patent
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Abstract
Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
Claims9
A dielectric thermosetting polymer composition configured as a base layer in a printed circuit board, wherein the dielectric thermosetting polymer composition has:
- (i) a glass transition temperature less than 135° C.;
- (i) a dielectric constant less than 2.8;
- and
- (iii) tensile modulus less than or equal to 3 GPa when the average temperature of the dielectric thermosetting polymer composition is below the glass transition temperature (Tg) of the dielectric thermosetting polymer composition;
- wherein the tensile modulus is substantially isotropic.
2 more elements
The dielectric thermosetting polymer composition of claim comprising an alkene-containing polymer.
Dependencies are inferred from the claim text.