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US 11,590,687 B2Granted
Systems and methods for reducing pressure while shaping a film
AssigneeCanon Kabushiki Kaisha
InventorsNiyaz Khusnatdinov, Mario Johannes Meissl, Seth J. Bamesberger
Life of this patent
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Abstract
Systems and methods of shaping a patterned or planarized film layer. Which may include contacting formable material on a substrate with a template during a contacting period, Which may also include reducing, during the contacting period, a pressure in an environment beyond an edge of the substrate from a first pressure to a second pressure, while the template is contacting the formable material.
Claims13
A method comprising:
- holding a template backside of a template with a template chuck, wherein the backside is opposite a shaping surface of the template;
- holding a substrate backside of a substrate with a substrate chuck, wherein the substrate backside is opposite a substrate surface, wherein the substrate surface is shaped by the shaping surface of the template;
- wherein a template chucking surface of the template chuck is facing a substrate chucking surface of the substrate chuck;
- bowing out the template by applying an initial positive pressure to a central portion of the template backside with the template chuck;
- initiating contacting of formable material on the substrate with the shaping surface of the template, during a contacting period by moving the substrate chuck and the template chuck towards each other;
- reducing, during the contacting period, a pressure in an environment between the substrate and the template from a first pressure to a second pressure, while the template is contacting the formable material;
- solidifying the formable material into a film layer on the substrate by exposing the formable material between the template and the substrate to actinic radiation;
- and
- separating the template from the film layer on the substrate by moving the template chuck and the substrate chuck away from each other, thereby forming the film layer on the substrate that reflects the shaping surface of the template.
6 more elements
A method comprising:
- holding a superstrate backside of a superstrate with a superstrate chuck, wherein the backside is opposite a planarization surface of the superstrate;
- holding a substrate backside of a substrate with a substrate chuck, wherein the substrate backside is opposite a substrate surface, wherein the substrate surface is planarized by the planarizing surface of the superstrate;
- wherein a superstrate chucking surface of the superstrate chuck is facing a substrate chucking surface of the substrate chuck;
- bowing out the superstrate by applying an initial positive pressure to a central portion of the superstrate backside with the superstrate chuck;
- initiating contacting of formable material on the substrate with the planarizing surface of the superstrate, during a contacting period by moving the substrate chuck and the superstrate chuck towards each other;
- reducing, during the contacting period, a pressure in an environment between the substrate and the superstrate from a first pressure to a second pressure, while the superstrate is contacting the formable material;
- solidifying the formable material into a planarization layer on the substrate by exposing the formable material between the superstrate and the substrate to actinic radiation;
- and
- separating the superstrate from the planarization layer on the substrate by moving the superstrate chuck and the substrate chuck away from each other, thereby forming the film layer on the substrate that reflects the planarizing surface of the superstrate.
6 more elements
Dependencies are inferred from the claim text.