Material feeding device, injection molding device, and three-dimensional modeling device
AssigneeSeiko Epson Corporation
InventorsHidenobu Maruyama, Kenta Anegawa
Life of this patent
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AssigneeSeiko Epson Corporation
InventorsHidenobu Maruyama, Kenta Anegawa
Estimating the term…
The material feeding device is configured so that in the state in which a hopper having an opening part and containing a material is attached to a coupling member configured so that the hopper is detachably attached to the coupling member, when the hopper is located in a first area, a first member configured to be able to make a sliding displacement on a slide surface having the first area where a feed hole is disposed makes the sliding displacement to a third area different from the first area to make it possible to take a communicated state in which the opening part and the feed hole are communicated with each other, and when the hopper is located in a second area, the first member makes a sliding displacement to the first area to make it possible to take a non-communicated state in which the first member covers the feed hole. The material feeding device takes the non-communicated state at least when the hopper is detached from the coupling member via a detachably attaching part disposed in the second area extending along a direction in which the first area extends.
A material feeding device comprising:
Dependencies are inferred from the claim text.