Mega-sonic vibration assisted chemical mechanical planarization
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Hao Kung, Shang-Yu Wang, Ching-Hsiang Tsai, Hui-Chi Huang, Kei-Wei Chen
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Abstract
A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.
Claims20
A chemical mechanical planarization (CMP) tool comprising:
- a carrier;
- a retainer ring attached to the carrier and configured to hold a wafer during a CMP process;
- and
- a megasonic generator attached to the carrier and configured to generate vibrations during the CMP process, wherein the megasonic generator is configured to, during the CMP process, generate a first burst of vibrations and a second burst of vibrations separated from the first burst of vibrations by a period of time with no vibration.
A method of performing a chemical mechanical planarization (CMP) process, the method comprising:
- rotating a polishing pad at a first rotational speed;
- dispensing a slurry on a first surface of the polishing pad;
- pressing a wafer against the first surface of the polishing pad, the wafer being held by a retaining ring of a carrier;
- and
- generating vibrations at the polishing pad during the CMP process using a megasonic generator, wherein generating the vibrations comprises generating a first burst of vibrations and a second burst of vibrations separated from the first burst of vibrations by a period of time with no vibration, wherein a first amplitude of the first burst of vibrations is different from a second amplitude of the second burst of vibrations.
A method of performing a chemical mechanical planarization (CMP) process, the method comprising:
- holding a wafer by a retainer ring attached to a carrier;
- pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed;
- dispensing a slurry on the first surface of the polishing pad;
- and
- generating vibrations at the polishing pad, wherein generating the vibrations comprises generating the vibrations with a first vibration frequency during a first stage of the CMP process, and generating the vibrations with a second vibration frequency different from the first vibration frequency during a second stage of the CMP process.
Dependencies are inferred from the claim text.