Roll-bonded body and method for producing same
AssigneeToyo Kohan Co., Ltd.
InventorsYusuke Hashimoto, Teppei Kurokawa, Takashi Koshiro, Kota Sadaki
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Abstract
[Problem] To provide: a roll-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roll-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa1) 0.01-0.96 and a maximum waviness height (Wz1) of 0.2-5.0 μm.
Claims13
A roll-bonded body obtained by bonding a first metal layer and a second metal layer to each other by rolling, wherein a surface of the first metal layer has an arithmetic average waviness (Wa1) of 0.01 to 0.96 μm and a maximum waviness height (Wz1) of 0.2 to 5.0 μm,
- wherein the arithmetic average waviness (Wa1) and the maximum waviness height (Wz1) is determined according to JIS B 0601:2001,
- wherein the first metal layer includes SUS, or Ni, Cu, or an alloy based on any one of these metals,
- wherein the second metal layer includes Al, or Mg, Cu, or an alloy based on any one of these metals.
A roll-bonded body obtained by bonding a first metal layer and a second metal layer to each other by rolling, wherein a surface of the first metal layer opposite to a bonded surface with the second metal layer has an arithmetic average waviness (Wa1) of 0.01 to 0.96 μm and a maximum waviness height (Wz1) of 0.2 to 5.0 μm when the surface is mirror polished to an arithmetic average roughness (Ra1) of 1 to 30 nm,
- wherein the arithmetic average waviness (Wa1) and the maximum waviness height (Wz1) is determined according to JIS B 0601:2001.
Dependencies are inferred from the claim text.