Topical antimicrobial formulations containing monovalent copper ions and systems for generating monovalent copper ions
OwnerOshra Saphier, Yoram Shotland +3inventors
InventorsOshra Saphier, Yoram Shotland, Stanislav Popov, Magal Saphier, Eldad Silberstein
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Abstract
The present invention relates to antimicrobial formulations. More particularly, the invention relates to monovalent copper-containing and/or monovalent copper-generating products for healing wounds and burns, and particularly for chronic wounds, prevention of wound infections and infections in various implants as well as medical/surgical devices.
Claims12
An antimicrobial formulation comprising a monovalent copper ions (cuprous, Cu1+) generating system, wherein the monovalent copper is produced in situ by reduction of divalent copper ions (cupric, Cu2+) selected from copper sulphate, CuSO4, copper chloride, CuCl2, copper acetate, Cu(CH3COO)2, and copper gluconate, C12H22CuO14 in the presence of a reducing agent;
- wherein the divalent copper ions source is a salt or complex which is able to release divalent copper ions into the reaction mixture that is an aqueous solution;
- wherein the reducing agent is selected from ascorbic acid or derivatives or salts thereof and metallic copper;
- wherein, when the reducing agent is metallic copper, the reduction is in the presence of a stabilizing ligand and the metallic copper is in the form of powder, wires, net, sheets or nanoparticles;
- and wherein the stabilizing ligand is acetonitrile.
An adhesive bandage comprising:
- copper wires;
- and ointment comprising copper powder (0-5%, w/w), copper(II) gluconate (0.1-15%) or copper(II) sulfate (0.1-15%) or any combination thereof as a divalent copper ions source, ascorbyl palmitate (0.1-15%) or ascorbic acid (0.1-15%) or any combination thereof as a reducing agent, and glycerol (0.1-25%), Vaseline (0.1-20%), lanolin (0.1-15%), sodium dodecyl sulfate (SDS) (0.1-2%), talc (0.1-0.5%) and water (0.1-15%) as filling agents.
Dependencies are inferred from the claim text.