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US 11,589,977 B2Granted
Kit for preparing a customizable flesh simulating silicone gel or silicone foam in particular for use in medical devices
AssigneesElkem Silicones USA Corp., Elkem Silicones Germany GmbH
InventorsMatthew Kihara, Francois Martin, Matthew Ryan, Yan Meng, Leeanne Brown
Life of this patent
Estimating the term…
Abstract
The present invention relates to a kit for preparing a customizable flesh simulating silicone gel or a flesh simulating silicone foam in particular for use in medical devices and a process for preparing said customizable flesh simulating silicone gel or silicone foam, in particular by using a 3D-printer.
Claims17
A kit for preparing a customizable flesh simulating silicone gel comprising:
- a first package Part-A comprising a mixture of:
- i) 5 to 95 parts by weight of at least one organopolysiloxane A1 having at least two alkenyl groups bonded to silicon per molecule, said alkenyl groups each containing from 2 to 14 carbon atoms, and
- ii) at least one hydrosilylation catalyst C1;
- a second package Part-B comprising a mixture of:
- i) 95 to 5 parts by weight of at least one organopolysiloxane A2 having at least two alkenyl groups bonded to silicon per molecule, said alkenyl groups each containing from 2 to 14 carbon atoms,
- ii) at least one organosilicon compound B1 having at least two hydrogen atoms bonded to silicon per molecule,
- iii) optionally at least one diorganohydrogensiloxy-terminated polyorganosiloxane as a chain extender B2, and
- iv) optionally a cure rate controller G1 which slows the curing rate, and
- a third package Part-C comprising:
- i) at least one linear polydimethylsiloxane D1 which has a dynamic viscosity at 25° C. of between 50 mPa·s and 100000 mPa·s,
- ii) optionally at least one organopolysiloxane A1 or A2, and
- iii) optionally at least one additive H1
- with the proviso that:
- e) the amounts of components A1 and A2 is 100 parts by weight when the contents of the three packages Part-A, Part-B and Part-C are combined,
- f) the components B1 and B2 are present in an amount such that the molar ratio of silicon-bonded hydrogen atoms contained in components B1 and B2 to alkenyl groups contained in components A1 and A2 ranges from 0.25 to 0.90;
- g) the amount of component D1 is at least about 0.1 part by weight percent to about 90 parts by weight for each 100 parts of the combined components A1 and A2 when the contents of the three packages Part-A, Part-B and Part-C are combined, and
- h) the component C1 is present in an amount sufficient to cure the composition formed when the contents of the three packages Part-A, Part-B and Part-C are combined.
14 more elements
Dependencies are inferred from the claim text.