MEMS device for an implant assembly
AssigneeEndotronix, Inc.
InventorsMohammad Faisal Zaman, Jeffrey Fong, Julian Chee, Tyler Panian, Michael Nagy
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Abstract
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
Claims26
An implant comprising:
- a housing that defines a housing cavity;
- a sensor connected to said housing comprising:
- a diaphragm configured to flex in response to external changes in pressure;
- a floating base attached to said diaphragm to define a capacitive gap between said diaphragm and said floating base, said attachment being positioned along a perimeter of said capacitive gap, wherein said capacitive gap includes at least one patterned electrode positioned on said floating base;
- wherein said floating base is positioned entirely within said cavity;
- and
- wherein said attachment along said perimeter contains at least one open portion.
An implant comprising:
- a housing that defines a cavity;
- a sensor connected to said housing comprising:
- a diaphragm having at least one diaphragm electrode;
- and
- a base attached to said diaphragm and positioned entirely within the cavity of said housing, said base including at least one base electrode wherein said base and diaphragm define a capacitive gap between the at least one diaphragm electrode and the at least one base electrode;
- and
- wherein said base attaches to said diaphragm along a perimeter of said capacitive gap, said attachment including at least one open portion configured to enhance at least one performance parameter of said implant.
An implant comprising:
- a housing having a plurality of walls and at least one opening;
- a sensor connected to an opening of said at least one opening in said housing, said sensor comprising:
- a first layer having a first dimension;
- a second layer having a second dimension shorter than said first dimension;
- wherein said second layer is positioned entirely within said housing and a surface of said first layer is exposed to the exterior of said housing;
- wherein said second layer is attached to said first layer to define a capacitive gap between layers, said attachment being positioned along a perimeter of said capacitive gap, wherein said capacitive gap includes at least one patterned electrode positioned on said second layer;
- wherein said attachment along said perimeter contains at least one open portion;
- and
- wherein a location of said at least one open portion is configured to enhance at least one performance parameter of said implant.
Dependencies are inferred from the claim text.