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US 11,587,798 B2Granted
High heat flux power electronics cooling design
AssigneeRolls-Royce North American Technologies Inc.
InventorDouglas J. Snyder
Life of this patent
Estimating the term…
Abstract
A base plate for cooling a power electronics device is provided, the base plate comprising cooling fins, the base plate configured to receive the power electronics device directly above the cooling fins, the cooling fins integral to the base plate, the base plate configured to conduct a liquid coolant past the cooling fins.
Claims2
A method of manufacturing a base plate for a semiconductor, method comprising:
- forming a plurality of pieces of the base plate from a metal sheet by etching openings in the metal sheet, wherein after etching, the pieces comprise a plurality of cooling fins;
- etching a portion of each of the cooling fins to form a corresponding passage adjacent to the respective one of the cooling fins;
- stacking the pieces;
- and
- bonding the stacked pieces together to form the base plate or a portion thereof, the cooling fins and the passages between the cooling fins being integral to, and included within, the base plate.
2 more elements
Dependencies are inferred from the claim text.