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US 11,587,581 B1Granted
Transfer-printed near-field transducer and heat sink
AssigneeSeagate Technology LLC
InventorsMark Gubbins, Roger L. Hipwell, Jr., Marcus B. Mooney, Mark Ostrowski, Tong Zhao, Michael J. Hardy, Michael Christopher Kautzky, Neil Zuckerman, Declan Macken, Francis A. McGinnity
Life of this patent
Estimating the term…
Abstract
A near-field transducer or heat sink is formed via a first process. The near-field transducer or heat sink is transfer-printed to a read/write head via a second process.
Claims20
A method comprising:
- forming a plurality of read/write head components via a first process, the plurality of read/write head components comprising one or both of near-field transducers and heat sinks;
- and
- transfer printing the plurality of read/write head components to a wafer comprising a plurality of read/write heads via a second process, the first process being incompatible with forming the plurality of read/write head components on the wafer.
A method comprising:
- creating, on a donor substrate, a material stack having a material layer and at least one of an adhesion layer, a protection layer, a carrier layer, a bonding layer, and planarization stop material layer, wherein a deposition temperature used in forming the material layer exceeds that which a read/write head tolerates;
- forming one or more islands from the material stack, the one or more islands being used to form one or more read/write head components;
- and
- transfer printing the islands to a wafer having one or more read/write heads.
1 more element
A method comprising:
- creating, on a donor substrate, a material stack having at least two of a material layer, an adhesion layer, a protection layer, a carrier layer, a bonding layer, and planarization stop material layer;
- forming one or more islands from the material stack, the one or more islands being used to form one or more near-field transducers, wherein a temperature used in forming the one or more islands exceeds that which a read/write head tolerates;
- and
- transfer printing the islands to a wafer having one or more read/write heads.
1 more element
Dependencies are inferred from the claim text.